SEMICONDUCTOR DEVICES
Yang Jiang, Min Tian, Huang Long, Jie Zhao, Shuai Chen and Huicai Zhong
Corresponding author: Jiang Yang,Email: jiangyang@ime.ac.cn
Abstract: This paper describes and analyses the impact of the Ti layer, which is embedded between the insulator and top electrode, on the programming characteristic of the Al-HfO2-Al antifuse. The programming voltage of the antifuse with 120 ? HfO2 is properly reduced from 5.5 to 4.6 V with an embedded Ti layer. Low on-state resistance (~19 Ω) and low programming voltage (4.6 V) is demonstrated in the embedded Ti antifuse with 120 ? HfO2 while keeping sufficient off-state reliability. The antifuse embedded with a Ti layer between the insulator and top electrode has been developed and has potential in field programmable devices.
Key words: antifuse, embedded Ti layer, lower programming voltage, HfO2
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Article views: 3571 Times PDF downloads: 28 Times Cited by: 0 Times
Received: 15 December 2015 Revised: Online: Published: 01 July 2016
| Citation: |
Yang Jiang, Min Tian, Huang Long, Jie Zhao, Shuai Chen, Huicai Zhong. Metal-to-metal antifuse with low programming voltage and low on-state resistance[J]. Journal of Semiconductors, 2016, 37(7): 074008. doi: 10.1088/1674-4926/37/7/074008
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Y Jiang, M Tian, H Long, J Zhao, S Chen, H C Zhong. Metal-to-metal antifuse with low programming voltage and low on-state resistance[J]. J. Semicond., 2016, 37(7): 074008. doi: 10.1088/1674-4926/37/7/074008.
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