Abstract: The criterion of microroughness for self-propagating wafer bonding is studied according to JKR contact theory, where the microroughness model is based on a sinusoidal distribution for gap height and gap length. Our analysis shows that the criterion for self-propagating wafer bonding is relevant to the dimensionless parameter.In silicon wafer bonding, using the dimensionless parameter as a measure,three regions of silicon wafer bonding can be identified:self-propagating silicon wafer bonding (α＞1.065),external pressure assisted silicon wafer bonding (0.57＜α＜1.065), and silicon wafer bonding with voids (α＜0.57).Experimental data are in reasonable agreement with this theory.

Key words: self-propagating wafer bonding, microroughness, JKR contact theory