LETTERS
Hao Yue, Yue Yuanzheng, Feng Qian, Zhang Jincheng, Ma Xiaohua and Ni Jinyu
Abstract: We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) Al2O3 as the gate dielectric.Through decreasing the thickness of the gate oxide to 3.5nm,a device with maximum transconductance of 130mS/mm is produced.The drain current of this 1μm gate-length MOS-HEMT can reach 720mA/mm at +3.0V gate bias.The unity current gain cutoff frequency and maximum frequency of oscillation are obtained as 10.1 and 30.8GHz,respectively.
Key words: AlGaN/GaN, MOS-HEMT, ultrathin Al2O3
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Received: 18 August 2015 Revised: 02 July 2007 Online: Published: 01 November 2007
| Citation: |
Hao Yue, Yue Yuanzheng, Feng Qian, Zhang Jincheng, Ma Xiaohua, Ni Jinyu. GaN MOS-HEMT Using Ultrathin Al2O3 Dielectric with fmax of 30.8GHz[J]. Journal of Semiconductors, 2007, 28(11): 1674-1678.
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Hao Y, Yue Y Z, Feng Q, Zhang J C, Ma X H, Ni J Y. GaN MOS-HEMT Using Ultrathin Al2O3 Dielectric with fmax of 30.8GHz[J]. Chin. J. Semicond., 2007, 28(11): 1674.
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