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Abstract: A novel three-dimensional (3D) continuous cellular automata (CA) model is presented for the simulation of silicon bulk etching processes.More high-index planes such as (211),(311),(331),(411) planes have been successfully incorporated into the novel 3D continuous CA model to increase the simulation accuracy.Simulation results agree with experimental results,indicating that the simulation accuracy has been increased.This is useful for the research of silicon bulk etching process and micro-electro-mechanical system (MEMS) design.
Key words: cellular automata, etching simulation, micromachining, MEMS, anisotropic etching
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Received: 18 August 2015 Revised: 12 January 2007 Online: Published: 01 May 2007
| Citation: |
Zhou Zaifa, Huang Qing'an, Li Weihua, Deng Wei. A Novel Cellular Automata Model for Silicon Bulk Etching Simulation Handling High Index Planes[J]. Journal of Semiconductors, 2007, 28(5): 731-736.
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Zhou Z F, Huang Q, Li W H, Deng W. A Novel Cellular Automata Model for Silicon Bulk Etching Simulation Handling High Index Planes[J]. Chin. J. Semicond., 2007, 28(5): 731.
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