PAPERS
Yu Lijuan, Zhao Hongquan, Du Yun, Li Jing and Huang Yongzhen
Abstract: A 1.55μm InP-InGaAsP quantum-well laser was fabricated on Si substrate by low-temperature wafer bonding,which lases at room temperature with electrical pumping.The InP epitaxy was designed and grown by MOCVD,then bonded to Si wafer.Finally,the laser with ridge-waveguide and edge-emission was fabricated.This laser runs continuous-wave with a threshold current of 48mA (current density of 1.65kA/cm2),differential resistance of 5.8W at the threshold current,and a maximum output power of 15mW at 220mA.
Key words: Si-based laser, continuous-wave lasing, wafer bonding
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Received: 18 August 2015 Revised: 01 March 2007 Online: Published: 01 July 2007
| Citation: |
Yu Lijuan, Zhao Hongquan, Du Yun, Li Jing, Huang Yongzhen. CW InP-InGaAsP Quantum-Well Laser on Si Fabricated by Wafer Bonding[J]. Journal of Semiconductors, 2007, 28(7): 1117-1120.
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Yu L J, Zhao H Q, Du Y, Li J, Huang Y Z. CW InP-InGaAsP Quantum-Well Laser on Si Fabricated by Wafer Bonding[J]. Chin. J. Semicond., 2007, 28(7): 1117.
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