Abstract: Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD.All specimens appear mixed texture and (111) texture is the dominate component.As-deposited interconnects undergo the phenomenon of self-annealing at RT,in which some abnormally large grains are found.Lower aspect ratio of lines and anneal treatment procured larger grains and stronger (111) texture.Meanwhile,the intensity proportion of other textures with lower strain energy to (111) texture is decreased.As-deposited specimens reveal (111)〈112〉 and (111)〈231〉 components.(111)〈110〉 component appeared and (111)〈112〉 and (111)〈231〉 components were developed during the annealing process.High angle boundaries are dominant in all specimens,boundaries with a misorientation of 55°~60° and Σ3 ones in higher proportion,followed by lower boundaries with a misorientation of 35°~40° and Σ9 boundaries.As the aspect ratio of lines and anneal treatment increase,there is a gradual increment in Σ3 boundaries and a decrease in Σ9 boundaries.

Key words: Cu interconnects, texture, misorientation, coincident site lattice boundaries, EBSD