LETTERS
Chen Yanhu, Shen Huajun, Wang Xiantai, Chen Gaopeng, Liu Xinyu, Yuan Dongfeng and Wang Zuqiang
Abstract: A MIC power amplifier with power combining based on InGaP/GaAs HBT is developed and measured for the application of the latest high power amplifier stage of the X-band.A novel InGaP/GaAs HBT power transistor with an on-chip RC stabilization network is used as the power combing cell to improve the stability of the circuit.A compact microstripe line parallel matching network is used to divide and combine the power.By biasing the amplifier at class AB:Vcc=7V,Ic=230mA,a maximum CW stabile output power of 28.9dBm and a power combine efficiency of 80% are achieved at 8.1GHz.
Key words: InGaP/GaAs HBT, power combining, MIC, power amplifiers
Article views: 5296 Times PDF downloads: 1318 Times Cited by: 0 Times
Received: 18 August 2015 Revised: 22 July 2008 Online: Published: 01 November 2008
| Citation: |
Chen Yanhu, Shen Huajun, Wang Xiantai, Chen Gaopeng, Liu Xinyu, Yuan Dongfeng, Wang Zuqiang. An InGaP/GaAs HBT MIC Power Amplifier with Power Combining at the X-Band[J]. Journal of Semiconductors, 2008, 29(11): 2098-2100.
****
Chen Y H, Shen H J, Wang X T, Chen G P, Liu X Y, Yuan D F, Wang Z Q. An InGaP/GaAs HBT MIC Power Amplifier with Power Combining at the X-Band[J]. J. Semicond., 2008, 29(11): 2098.
|
Journal of Semiconductors © 2017 All Rights Reserved 京ICP備05085259號-2