Chin. J. Semicond. > 2007, Volume 28?>?Issue 6?> 995-1000

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Finite Element Simulation and Process Optimization of Localized Laser Bonding

Ma Ziwen, Tang Zirong, Liao Guanglan, Shi Tielin, Nie Lei and Zhou Ping

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Abstract: The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method.In the model,the temperature distribution with different process parameters is simulated and the bondline width is obtained.Then the key process parameters of laser bonding,including laser power,scanning velocity,and initial temperature,are obtained with the help of scanning experiments.Finally,with regression analysis on the simulation results,a regression model is made and the optimal process parameters of laser bonding are found.This can provide a theoretical basis for further study on laser bonding.

Key words: laser bonding, finite element method, regression analysis, bondline width

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    Received: 18 August 2015 Revised: 15 December 2006 Online: Published: 01 June 2007

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      Ma Ziwen, Tang Zirong, Liao Guanglan, Shi Tielin, Nie Lei, Zhou Ping. Finite Element Simulation and Process Optimization of Localized Laser Bonding[J]. Journal of Semiconductors, 2007, 28(6): 995-1000. ****Ma Z W, Tang Z R, Liao G L, Shi T L, Nie L, Zhou P. Finite Element Simulation and Process Optimization of Localized Laser Bonding[J]. Chin. J. Semicond., 2007, 28(6): 995.
      Citation:
      Ma Ziwen, Tang Zirong, Liao Guanglan, Shi Tielin, Nie Lei, Zhou Ping. Finite Element Simulation and Process Optimization of Localized Laser Bonding[J]. Journal of Semiconductors, 2007, 28(6): 995-1000. ****
      Ma Z W, Tang Z R, Liao G L, Shi T L, Nie L, Zhou P. Finite Element Simulation and Process Optimization of Localized Laser Bonding[J]. Chin. J. Semicond., 2007, 28(6): 995.

      Finite Element Simulation and Process Optimization of Localized Laser Bonding

      • Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science and Technology, Wuhan 430074,China

      • Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science and Technology, Wuhan 430074,China

      • Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science and Technology, Wuhan 430074,China

      • Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science and Technology, Wuhan 430074,China

      • Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science and Technology, Wuhan 430074,China

      • Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science and Technology, Wuhan 430074,China

      • Received Date: 2015-08-18
      • Accepted Date: 2006-10-15
      • Revised Date: 2006-12-15
      • Published Date: 2007-05-30

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