• 1. School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, ChinaSchool of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
• 2. Department of Electronic Engineering, Tsinghua University, Beijing 100084, ChinaDepartment of Electronic Engineering, Tsinghua University, Beijing 100084, China

Author Bio:

• Zheng Wang received the B.S. and M.S. degrees from Tsinghua University, Beijing, China, in 2007 and 2010, respectively, and the Ph.D. degree in electrical engineering from the University of California at Irvine, Irvine, CA, USA, in 2014. From 2014 to 2017, he was with Qualcomm Inc., San Diego, CA, USA, working on RFIC design for cellular application. In 2017, he joined the University of Electronic Science and Technology of China (UESTC), Chengdu, China, as a Professor. His research interests include the design of novel radio frequency (RF), millimeter-wave (mmW), and terahertz (THz) silicon-based integrated circuits for the next-generation 10-Gb wireless communications as well as imaging systems.
• Yan Lu received the Ph.D. degree in electronic and computer engineering from The Hong Kong University of Science and Technology (HKUST), Hong Kong, China, in 2013. From 2014 to 2024, he was with the State Key Laboratory of Analog and Mixed-Signal VLSI, University of Macau, Macau, China. In 2024, He joined the Department of Electronic Engineering, Tsinghua University, Beijing, China, as a Full Professor with the endowed Xing-Hua Chair Professorship. His research interests include high-density power converters, integrated voltage regulators, wireless power transfer and energy-harvesting circuits and systems.

• Zheng Wang
• Yan Lu

 Corresponding author: Zheng Wang, wangzheng@uestc.edu.cn; Yan Lu, yanlu@tsinghua.edu.cn