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J. Semicond. > 2008, Volume 29?>?Issue 10?> 2018-2022

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Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films

Hu Dongmei, Huang Qing'an and Li Weihua

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Abstract: A novel method for electrically measuring the thermal expansion coefficient of polysilicon thin films is presented.A thermal-electro-mechanical compliant model of the polysilicon thin film is established.Finite element software Coventor and ANSYS are used to verify this method.This method is convenient,and its output is in the form of an electrical signal.Thus,it is valuable for in-situ measuring the thermal expansion coefficient of polysilicon thin films

Key words: thermal expansion coefficient, polysilicon thin films, electrical measurement, pull-in

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    Received: 18 August 2015 Revised: 12 May 2008 Online: Published: 01 October 2008

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      Hu Dongmei, Huang Qing'an, Li Weihua. Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films[J]. Journal of Semiconductors, 2008, 29(10): 2018-2022. ****Hu D M, Huang Q, Li W H. Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films[J]. J. Semicond., 2008, 29(10): 2018.
      Citation:
      Hu Dongmei, Huang Qing'an, Li Weihua. Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films[J]. Journal of Semiconductors, 2008, 29(10): 2018-2022. ****
      Hu D M, Huang Q, Li W H. Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films[J]. J. Semicond., 2008, 29(10): 2018.

      Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films

      • Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China

      • Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China

      • Key Laboratory of MEMS of the Ministry of Education,Southeast University,Nanjing 210096,China

      • Received Date: 2015-08-18
      • Accepted Date: 2008-04-07
      • Revised Date: 2008-05-12
      • Published Date: 2008-11-11

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