PAPERS
Zhang Qingzhao, Xie Changqing, Liu Ming, Li Bing, Zhu Xiaoli and Chen Baoqin
Abstract: In order to understand the relationship between RF bias voltage on bottom electrode and other process parameters,we designed an experiment.The results indicated that the relationship varies depending on the other parameters' variation.The upper electrode RF power,the bottom electrode RF power,and gas pressure all distinctly affect this relationship.
Key words: plasma, RF bias voltage, ICP, dry etch
Article views: 5656 Times PDF downloads: 1688 Times Cited by: 0 Times
Received: 18 August 2015 Revised: 09 November 2007 Online: Published: 01 May 2008
| Citation: |
Zhang Qingzhao, Xie Changqing, Liu Ming, Li Bing, Zhu Xiaoli, Chen Baoqin. RF Bias Voltage in ICP Etch Systems[J]. Journal of Semiconductors, 2008, 29(5): 980-983.
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Zhang Q Z, Xie C Q, Liu M, Li B, Zhu X L, Chen B Q. RF Bias Voltage in ICP Etch Systems[J]. J. Semicond., 2008, 29(5): 980.
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